1. Fully Automated Loading/Unloading: Supports multi-cassette handling for both Wafer and Frame, compatible with 4" to 6" substrates.
2. Dual-Station Motion Platform: Enables parallel processing where optical inspection and automatic ink-marking occur simultaneously.
3. High-Resolution Color Optics: Features a large field of view, embedded trigger acquisition, and multi-channel light composite inspection.
4. Flexible Configuration: Allows users to define custom defect types, build component libraries, and flexibly arrange inspection algorithms.
5.Intelligent Data Management: Automatically generates defect distribution mapping and supports automatic data merging with prober results.
6. Self-Optimizing AI Engine: Features adaptive optimization, online incremental training, and automatic adaptation to complex process variations.