1.Equipped with HEPA filter and a series of measures to control the particle generation to a very low level.
2.Support up to 8-inch wafer frame input and output.
3.Linear motor driven bond head X/Z table, pick and place force control with voice coil motor, missing units detection and auto-repick capability, die angle auto adjustment .
4.Equipped with 3 optics for wafer table PR, die uplook PR and bin table PR inspection.
5.Equipped with Multiple pin ejector system and programmable height of ejector pin.
6.Equipped with wafer barcode reader to auto load wafermap, support wafer scanning and wafermap auto reference.